Innovative Backside Power Delivery with PowerVia

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Published May 6, 2025

PowerVia, an industry-first using a backside delivery scheme with optimized signal routing, reduction in power leakage and the use of NANO TSV – 500x smaller than other advanced packaging technologies – delivers increased computing performance for the next era.

Learn more about PowerVia: https://www.intel.com/content/www/us/en/silicon-innovations/6-pillars/process.html

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Innovative Backside Power Delivery with PowerVia | Intel Technology
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