Introducing RibbonFET and PowerVia | Intel Technology

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After pioneering FinFETs in 2011, we’re introducing a whole new transistor architecture built on stackable nanoribbons we’re calling RibbonFET. RibbonFET transistors feature ribbon-shaped channels surrounded by the gate, which ultimately leads to better performance in a smaller footprint.

Delivering power and signal to transistors the traditional way creates inefficiencies, hampering power and performance. Intel will have an industry-first deployment of a backside power delivery network for transistors when PowerVia comes to the Intel 20A node in 2024.

Find out more about these new innovations: https://www.intel.com/content/www/us/en/silicon-innovations/6-pillars/process.html

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Introducing RibbonFET and PowerVia | Intel Technology
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Intel
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introducing ribbonfet and powervia, ribbonfet, powervia
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